HDI PCB Manufacturing · Semiconductor Trade House · AI Engineering

Precision,
built in India.
Shipped worldwide.

One partner for the electronics supply chain — 4 to 32 layer HDI boards from our Chennai fab, authorized components from our trade house, and AI-engineered products under one roof.

Book a plant tour
Macro view of the copper traces and microvias on an HDI printed circuit board
Fab floor live
92.4%
Line utilisation across six HDI lines in Chennai
Qualified, certified and audited to
ISO 9001IATF 16949AS9100DISO 13485IPC-6012 Class 3UL RecognisedRoHS / REACHAS6081ANSI/ESD S20.20ISO 14001
One operating system for hardware

Fabricate.
Source.
Ship.

Bare board fabrication, component distribution and finished assembly run on a single traceability spine — so a change on the fab floor is visible to every buyer, planner and engineer.

Fab Trade Digital
Wk 38 · FY26
HDI multilayer96%
Rigid-flex81%
Metal core / IMS74%
99.4%
On-time
26h
Quote turn
0.8%
PPM escape
Three divisions, one supply chain

Fab, trade and digital — engineered to work together.

Inside Yantra Semitech →
Capability index

Every board technology, documented and inspectable.

Filter our in-house technologies by process family or search a term to see the tolerance we build to.

Design rules & stack-up library

Downloadable DFM handbook, impedance stack-ups and material data sheets for your next build.

Open the library →
  • 01

    Any-layer HDI

    Fabrication

    Laser-drilled 50 µm microvias, stacked and staggered via structures, 40/40 µm line width and spacing, sequential lamination up to 4 build-up cycles.

  • 02

    High-layer-count multilayer

    Fabrication

    4 to 32 layers with backdrilling, via-in-pad plated over, controlled impedance ±8% and aspect ratios to 12:1 for dense digital and RF backplanes.

  • 03

    Rigid-flex & flex

    Materials

    Adhesive-less polyimide constructions to IPC-6013 Type 3 and Type 4, dynamic bend rated to 100,000 cycles, air-gap and bond-ply stack-ups.

  • 04

    Metal core & IMS

    Materials

    Aluminium and copper base boards with thermal vias, plus heavy copper to 12 oz for power conversion, motor drive and battery management.

  • 05

    RF & microwave

    Materials

    PTFE and hydrocarbon laminates, mixed-dielectric builds, tight Dk/Df control and press-fit or edge-launch transitions to 40 GHz.

  • 06

    Assembly, test & finish

    Assembly

    SMT and through-hole assembly to J-STD-001 Class 3, flying-probe and ICT test, AOI/ACI and X-ray, with ENIG, ENEPIG, hard gold and OSP finishes.

Scale, in numbers
45k m²
PCB output per month
60+
Countries delivered
1,200
Active OEM customers
99.4%
On-time delivery
Industries

Boards and parts for the markets that cannot fail.

All industries →
High-voltage battery pack and power electronics inside an electric vehicle

Automotive & EV

IATF 16949 lines, PPAP documentation and 12 oz heavy copper for BMS, inverter and ADAS boards.

Satellite in orbit above Earth's cloud formations

Aerospace & defence

AS9100D processes, PTFE RF builds and full material traceability for avionics and radar.

Medical monitoring device with digital display and cables in a hospital

Medical devices

ISO 13485 builds, biocompatible finishes and validated processes for imaging and diagnostics.

Cellular communications tower against a blue sky

Telecom & 5G

Low-loss laminates, mixed dielectric and press-fit backplanes for radios and massive MIMO.

Rows of servers in a data centre with blue and red lighting

Data centre & AI hardware

High-layer-count, low-loss boards and power delivery hardware for compute and accelerator platforms.

Yellow industrial robotic arm working on a modern manufacturing line

Industrial & energy

Robust control, metering and power boards rated for heat, vibration and 20-year service life.

Engagement models

From a single prototype panel to a multi-year supply programme.

Indicative pricing in USD. Volume, stack-up and finish drive the final quotation — most quotes land in 26 hours.

Prototype
$480 / PANEL

72-hour quick-turn HDI prototypes, 1–20 pieces, with free DFM review before release.

Volume production
$9.20 / UNIT

Serial HDI and multilayer builds from 500 to 500,000 units a month with VMI and bonded stock.

Supply programme
Custom

Multi-year agreements covering BOM sourcing, obsolescence management and dedicated capacity.

Customers

Trusted with the boards that carry the production line.

“We moved our 20-layer backplane from a European supplier to Yantra and held the same impedance profile with a 31% cost reduction. Their DFM feedback arrived before we finished the drawing package.”
Portrait of Andreas Keller, Head of Hardware Engineering
Andreas Keller
Head of Hardware, telecom OEM · Germany
“The trade house consolidated 46 component suppliers into one line card. Our BOM coverage went from 88% to 99.6% and obsolescence risk is now managed before it hits the schedule.”
Portrait of Priya Raman, Director of Supply Chain
Priya Raman
Director of Supply Chain · India
“IATF 16949 paperwork, PPAP packs and full traceability — for an automotive Tier 1 the audit trail matters as much as the board. Yantra has passed every one of ours.”
Portrait of Daniel Okonkwo, Quality Director
Daniel Okonkwo
Quality Director, automotive Tier 1 · UK

Send us
your stack-up.

Gerbers, a BOM, or just a target cost — our engineers will come back with a buildable answer inside one working day.