From models
that learn to
agents that act.
We build AI where the physics is real — on fab floors, in inspection cells and across multi-tier component supply chains. The output is not a dashboard; it is a shorter cycle time, a caught defect, a mitigated shortage.
An intelligent foundation for an adaptive, responsible AI ecosystem.
Data & AI
MES, AOI, ERP and supplier data unified into a governed lakehouse, then modelled: demand sensing, yield prediction, AOI defect classification, recipe optimisation and predictive maintenance on the press, plating and laser lines.
Innovation ecosystems
Joint development programmes with institutes, EMS partners and fabless design houses — from proof of concept to qualified production.
Platforms & communities
Yantra Nexus connects buyers, engineers and suppliers with shared design rules, data models and a semiconductor skilling curriculum.
Engineering & R&D
140 sales engineers and 300+ R&D staff across signal integrity, thermal, materials science, embedded firmware and test development.
AI-powered products
Hardware and software we own and ship — edge inference modules, sensing platforms and the agent stack that runs on them.
Agents that
act on the
factory floor.
Our agents do not just report. A drift in plating thickness opens a corrective-action task, re-sequences the affected lots and notifies the customer's planner — inside the same shift.
Three platforms, shipping today.
Yantra Nexus
Supply-chain risk intelligence: multi-tier BOM mapping, allocation forecasting, lifecycle and geopolitical risk scoring.
- — 4,000+ part numbers monitored
- — 26h average BOM response
- — API and ERP connectors
Yantra Vision
Computer-vision inspection for AOI, ACI and X-ray: defect classification, root-cause linkage and closed-loop recipe feedback.
- — 0.8% escape rate
- — 99.72% first-pass yield
- — Edge deployment on existing cameras
Yantra Twin
A digital twin of the fab and the warehouse: capacity simulation, what-if scheduling and throughput optimisation.
- — Line-level simulation
- — 6 lines modelled in real time
- — Scenario planning in minutes
Bring us the hard problem.
Our engineering group works on signal integrity, thermal design, materials, embedded firmware and test development — for our own lines and for customer programmes.
Innovation brief
Tell us the constraint. We will come back with a feasibility view and a funded path.
Start a conversation →- 01
AI-driven DFM & design review
Automated design-rule analysis, stack-up optimisation, panel utilisation and cost-down proposals returned with your quote.
- 02
Signal & power integrity
3D field solving, TDR correlation, backdrill strategy, PDN impedance and thermal co-simulation for high-speed designs.
- 03
Materials & reliability engineering
Laminate selection, CAF and thermal-cycle qualification, HAST and IST testing, and failure analysis with microsection.
- 04
Embedded & firmware
Board bring-up, secure boot, RTOS and Linux BSP work, drivers and OTA pipelines for AI-powered hardware products.
- 05
Test development & automation
ICT and functional test fixtures, boundary scan, ATE programmes and data pipelines that close the loop to yield models.
Let's build the
future of AI.
Across data and AI, engineering, R&D and AI-powered products — with an intelligent foundation that lasts.